Intel numbers boss swears big Foundry wins are coming soon

Intel's Foundry division is near to sealing a deal for its advanced packaging technology that would contribute billions of dollars a year to the struggling chipmaker, CFO David Zinsner said on Wednesday.

"We've gotten really good engagement from customers on this business," he said during the Morgan Stanley Technology, Media and Telecom conference on Wednesday. "We're close to closing some deals that are in the billions of dollars per year in terms of revenue."

Advanced packaging has become a focal point of semiconductor manufacturing amid the AI boom as accelerators have grown more complex, meaning many GPUs are composed of multiple compute and memory dies that must be fused together.

Intel has invested heavily in its EMIB and Foveros 2.5D and 3D packaging tech to support multi-die processors like its Xeon CPUs and (now discontinued) Ponte Vecchio family of GPU Max accelerators. Perhaps more importantly, that ...