Cadence launches partner ecosystem to accelerate chiplet time to market

Cadence has unveiled a new Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for customers developing chiplets for physical AI, data centre and high-performance computing (HPC) applications.

The ecosystem brings together a broad set of IP and silicon analytics partners, including Arm, Arteris, eMemory, M31 Technology, Silicon Creations and Trilinear Technologies, along with silicon analytics specialist proteanTecs. To further de-risk adoption, Cadence is also collaborating with Samsung Foundry to develop a silicon prototype demonstration of its Physical AI chiplet platform, featuring pre-integrated partner IP on Samsung Foundry’s SF5A process.

Accelerating physical and infrastructure AI innovation

Building on a long-standing collaboration, Cadence and Arm are working closely to accelerate innovation across physical and infrastructure AI use cases. Cadence will leverage the Arm Zena Compute Subsystem (CSS) and other essential IP to enhance its Physical AI chiplet platform and Chiplet Framework.

The resulting solutions are ...