Tech »  Topic »  These HBM4 modules are set for immediate use in Rubin performance demonstrations ahead of the official GTC 2026 unveiling.

These HBM4 modules are set for immediate use in Rubin performance demonstrations ahead of the official GTC 2026 unveiling.

2 hours ago   techradar.com

Samsung Electronics and Nvidia are reportedly working closely to integrate Samsung’s next-generation HBM4 memory modules into Nvidia’s Vera Rubin AI accelerators.

Reports say the collaboration follows synchronized production timelines, with Samsung completing verification for both Nvidia and AMD and preparing for mass shipments in February 2026.

Samsung and Sandisk are set to integrate rival HBF technology into AI products from Nvidia, AMD, and Google within 24 months, and that's a huge dealAMD says its Instinct MI500 AI Accelerator will come in 2027 — but is it too late with Nvidia set to introduce Vera-Rubin in 2026?New 'serial' tech will significantly reduce the cost of memory — HBM memory, that is, the sort of RAM only AI hyperscalers can use, but hey, at least they won't go after consumer RAM, or would they?

Technical integration and joint innovation

Samsung’s HBM4 operates at 11.7Gb/s, exceeding ...


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