Chip giant Intel has announced a $3.5 billion investment to ramp up its Rio Rancho manufacturing facility in New Mexico.
The multiyear investment aims to upgrade the facility to manufacture advanced semiconductor packaging technologies, including its 3D packaging technology dubbed Foveros.
The investment follows a further announcement from Intel earlier this year that it would be building two new semiconductor factories in Arizona at a cost of $20 billion.
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This series of investments formpart of new Intel CEO Pat Gelsinger’s overhaul of the company’s integrated device manufacturing (IDM) model, which includes setting up a new semiconductor manufacturing business called Intel Foundry Services.
“We’re proud to have invested in New ...
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