Apple iPhone 18 Pro Max and foldable iPhone get first dibs on TSMC's 2nm process, A20 chip

In a nutshell: Apple is on track to become the first handset maker to ship a smartphone powered by processing hardware based on TSMC's 2nm process. The chip, tentatively referred to as the A20, will also reportedly utilize the latest wafer-level multi-chip module (WMCM) packaging technology.

Sources familiar with the matter tell the Commercial Times that production of the A20 SoC will begin at the Chiayi AP7 plant in Taiwan. The current generation iPhone 16 utilizes the A18 SoC, and the iPhone 17 due out this fall will be powered by the A19. According to the publication, the A20 will be reserved for the higher-end iPhone 18 Pro Max as well as the long-rumored foldable iPhone.

WMCM is a packaging technology in which multiple components, like the CPU, GPU, and memory, are integrated into a single package at the wafer level. According to Patently Apple, this allows for greater ...