Micron delivers industry’s highest capacity SOCAMM2 for low-power DRAM in the AI data centre

In an era of unprecedented AI innovation and growth, the entire data centre ecosystem is transforming toward more energy-efficient infrastructure to support sustainable growth. With memory playing an increasingly critical role in AI systems, low-power memory solutions have become central to this transformation. Micron Technology, Inc. announced customer sampling of 192GB SOCAMM2 (small outline compression attached memory modules) to enable broader adoption of low-power memory within AI data centres. SOCAMM2 extends the capabilities of Micron’s first-to-market LPDRAM SOCAMM, delivering 50% more capacity in the same compact footprint. The added capacity can significantly reduce time to first token (TTFT) by more than 80% in real-time inference workloads. The 192GB SOCAMM2 uses Micron’s most advanced 1-gamma DRAM process technology to deliver greater than 20% improvement in power efficiency, further enabling power design optimisation of large data centre clusters. These savings become quite significant in full-rack AI installations, which can include ...